US 12,459,860 B2
Method for manufacturing joined body and device for manufacturing joined body
Toru Shiragami, Shiga (JP)
Assigned to NIPPON ELECTRIC GLASS CO., LTD., Shiga (JP)
Appl. No. 18/288,680
Filed by Nippon Electric Glass Co., Ltd., Shiga (JP)
PCT Filed May 17, 2022, PCT No. PCT/JP2022/020576
§ 371(c)(1), (2) Date Oct. 27, 2023,
PCT Pub. No. WO2023/276478, PCT Pub. Date Jan. 5, 2023.
Claims priority of application No. 2021-107851 (JP), filed on Jun. 29, 2021.
Prior Publication US 2024/0217872 A1, Jul. 4, 2024
Int. Cl. C03C 27/04 (2006.01); C03C 27/10 (2006.01)
CPC C03C 27/048 (2013.01) [C03C 27/10 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A method for producing a bonded body including a first substrate, a second substrate, and a sealing layer bonding the first substrate and the second substrate, the method comprising:
laminating to form a laminate by overlapping the first substrate and the second substrate while interposing a sealing material between the first substrate and the second substrate; and
bonding to form the sealing layer by irradiating the sealing material in the laminate with a laser beam,
wherein the bonding includes supporting to mount the laminate on a support device, pressing the laminate, and performing laser irradiation to irradiate the sealing material with the laser beam,
wherein the support device includes
a pressing member configured to press the laminate,
a base member supporting the pressing member,
a supporting member configured to support the laminate, and
a fixing mechanism configured to fix the supporting member to the base member,
wherein the fixing mechanism includes
a fixing member including a head and a shaft, and
a hole formed in the supporting member and through which the shaft is insertable, and
wherein the supporting includes fixing the supporting member to the base member by the fixing mechanism.