US 12,459,818 B2
Method for manipulating flake-like material and method for producing article containing flake-like material
Tomoki Machida, Tokyo (JP); Momoko Onodera, Tokyo (JP); and Taketo Hashimoto, Tokyo (JP)
Assigned to The University of Tokyo, Tokyo (JP); and RIKEN TECHNOS CORPORATION, Tokyo (JP)
Filed by The University of Tokyo, Tokyo (JP); and RIKEN TECHNOS CORPORATION, Tokyo (JP)
Filed on May 15, 2023, as Appl. No. 18/317,467.
Claims priority of application No. 2022-094928 (JP), filed on Jun. 13, 2022.
Prior Publication US 2023/0415372 A1, Dec. 28, 2023
Int. Cl. C01B 21/064 (2006.01); C01B 32/194 (2017.01); C08J 5/18 (2006.01)
CPC C01B 21/0648 (2013.01) [C01B 32/194 (2017.08); C08J 5/18 (2013.01); C01P 2002/76 (2013.01); C01P 2004/24 (2013.01); C08J 2327/06 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A method for manipulating a flake-like material, the method comprising:
(1) a step of preparing a first probe of which a tip is covered with a first resin film and a second probe of which a tip is covered with a second resin film;
(2) a step of grounding the first probe of which the tip is covered with the first resin film on the flake-like material left still on a substrate, and pressing the first probe to pick up the flake-like material;
(3) a step of grounding the second probe of which the tip is covered with the second resin film on a surface on an opposite side to the first probe of the flake-like material picked up by the first probe in the step (2), and pressing the second probe; and
(4) a step of transferring the flake-like material picked up by the first probe to the second probe by separating the first probe and the second probe,
wherein (i) a thickness ratio (thickness B/thickness A) of a thickness B of the second resin film to a thickness A of the first resin film when pressing is not performed is less than 1.