| CPC B32B 25/08 (2013.01) [B32B 5/02 (2013.01); B32B 7/027 (2019.01); B32B 7/12 (2013.01); B32B 25/10 (2013.01); B32B 25/20 (2013.01); B32B 27/283 (2013.01); C09J 7/25 (2018.01); C09J 7/38 (2018.01); B32B 2262/101 (2013.01); B32B 2307/302 (2013.01); B32B 2307/732 (2013.01); C08K 2003/2227 (2013.01); C08K 7/18 (2013.01); C09J 2483/006 (2013.01)] | 9 Claims |
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1. A thermal conductive composite silicone rubber sheet comprising a thermal conductive silicone rubber sheet and a thermosoftening silicone resin layer provided with a thickness of 0.5 to 10 μm on at least one side of the thermal conductive silicone rubber sheet, the thermosoftening silicone resin layer having an absolute viscosity at 70° C. of 700 Pa·s or lower, wherein
the thermosoftening silicone resin layer has adhesion of 0.5 N/25 mm or higher at a normal temperature and contains no heat conductive filler, and
the thermal conductive composite silicone rubber sheet has a thermal resistance that is lower than a value obtained by adding 0.3 cm2·K/W per one layer of one side of the thermosoftening silicone resin layer provided on at least one side of the thermal conductive silicone rubber sheet to a thermal resistance of the thermal conductive silicone rubber sheet wherein the thermal conductive silicone rubber sheet has a silicone rubber component comprising a dimethylsiloxane unit, and the thermosoftening silicone resin layer has a phenyl modification rate of greater than 20 mol %.
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