US 12,459,234 B2
Multilayer structure
Takeshi Murashige, Osaka (JP); Junichi Inagaki, Osaka (JP); Keisuke Sato, Osaka (JP); and Atsushi Kishi, Osaka (JP)
Assigned to NITTO DENKO CORPORATION, Ibaraki (JP)
Appl. No. 17/915,027
Filed by Nitto Denko Corporation, Ibaraki (JP)
PCT Filed Mar. 10, 2021, PCT No. PCT/JP2021/009467
§ 371(c)(1), (2) Date Sep. 27, 2022,
PCT Pub. No. WO2021/199985, PCT Pub. Date Oct. 7, 2021.
Claims priority of application No. 2020-059417 (JP), filed on Mar. 30, 2020.
Prior Publication US 2023/0053803 A1, Feb. 23, 2023
Int. Cl. B32B 15/04 (2006.01); B32B 7/12 (2006.01); B32B 15/08 (2006.01); B32B 17/06 (2006.01); B32B 17/10 (2006.01)
CPC B32B 17/10018 (2013.01) [B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 17/10 (2013.01); B32B 17/10247 (2013.01); B32B 2250/05 (2013.01); B32B 2307/412 (2013.01); B32B 2307/732 (2013.01); B32B 2307/7376 (2023.05)] 8 Claims
OG exemplary drawing
 
1. A multilayer structure comprising:
a resin layer; and
a glass layer laminated on the resin layer via an adhesive layer, wherein
a thickness of the glass layer is 10 μm or more and 300 μm or less, and
an arithmetic mean waviness Wa of an interface of the resin layer and the adhesive layer is 10 μm or less.