US 12,459,227 B2
Substrate
Takamasa Nagasawa, Nagano (JP)
Assigned to SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed by SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed on May 18, 2023, as Appl. No. 18/319,657.
Claims priority of application No. 2022-086984 (JP), filed on May 27, 2022.
Prior Publication US 2023/0382076 A1, Nov. 30, 2023
Int. Cl. B32B 3/20 (2006.01); B32B 15/08 (2006.01); B32B 18/00 (2006.01); B82Y 30/00 (2011.01)
CPC B32B 3/20 (2013.01) [B32B 15/08 (2013.01); B32B 18/00 (2013.01); B32B 2250/40 (2013.01); B32B 2307/202 (2013.01); B32B 2307/302 (2013.01); B82Y 30/00 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A substrate, comprising:
a heat conduction member including a plurality of carbon nanotubes, a first resin layer provided on first ends of the plurality of carbon nanotubes, and a second resin layer provided on second ends of the plurality of carbon nanotubes, the second ends being opposite the first ends;
a first metal layer laminated on the first resin layer; and
a second metal layer laminated on the second resin layer,
wherein neither the first resin layer nor the second resin layer contains a filler,
wherein spaces between the first ends of the plurality of carbon nanotubes are filled with a resin constituting the first resin layer, and spaces between the second ends of the plurality of carbon nanotubes are filled with a resin constituting the second resin layer, and
wherein the first resin layer and the second resin layer are formed of a polyphenylene ether-based resin.