US 12,459,147 B2
Cutting apparatus
Hayato Iga, Tokyo (JP); Yuichi Kitazumi, Tokyo (JP); and Kwangyoung Jung, Tokyo (JP)
Assigned to DISCO CORPORATION, Tokyo (JP)
Filed by DISCO CORPORATION, Tokyo (JP)
Filed on Nov. 2, 2023, as Appl. No. 18/500,678.
Claims priority of application No. 2022-183902 (JP), filed on Nov. 17, 2022.
Prior Publication US 2024/0165842 A1, May 23, 2024
Int. Cl. B26D 5/00 (2006.01); B26D 1/04 (2006.01)
CPC B26D 5/007 (2013.01) [B26D 1/04 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A cutting apparatus comprising:
a chuck table that holds a wafer;
a cutting unit that includes, in a rotatable manner, a cutting blade for cutting the wafer held by the chuck table while supplying water;
an image capturing unit that is disposed adjacent to the cutting unit and that captures an image of the wafer held by the chuck table, to detect a region to be cut; and
a processing feeding mechanism that performs processing feeding of the wafer,
wherein the image capturing unit includes a camera, an assembled lens that is connected to the camera and that magnifies a region to be imaged, a cover lens that covers an objective lens of the assembled lens, a fluid spray nozzle that sprays a fluid including water to the cover lens, a fluid removing nozzle that blows air to the cover lens to remove the fluid deposited on the cover lens, and a cutting water removing nozzle that blows air to the wafer positioned at a position directly under the cover lens, to remove cutting water stagnating on an upper surface of the wafer.