US 12,459,078 B2
In-situ conditioner disk cleaning during CMP
Haosheng Wu, San Jose, CA (US); Shou-Sung Chang, Mountain View, CA (US); Jianshe Tang, San Jose, CA (US); Jeonghoon Oh, Saratoga, CA (US); Chad Pollard, San Jose, CA (US); Chih Chung Chou, San Jose, CA (US); Ningzhuo Cui, Santa Clara, CA (US); and Hui Chen, San Jose, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Oct. 17, 2022, as Appl. No. 17/967,762.
Claims priority of provisional application 63/349,560, filed on Jun. 6, 2022.
Prior Publication US 2023/0390895 A1, Dec. 7, 2023
Int. Cl. B24B 53/017 (2012.01); B24B 37/04 (2012.01); B24B 53/00 (2006.01); B24B 53/007 (2006.01); B24B 53/12 (2006.01)
CPC B24B 53/017 (2013.01) [B24B 37/042 (2013.01); B24B 53/005 (2013.01); B24B 53/007 (2013.01); B24B 53/12 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A polishing system, comprising:
a platen to hold a polishing pad;
a carrier head to hold a substrate against the polishing pad;
a conditioner including a conditioner head to hold a conditioner disk against the polishing pad;
a motor to move the conditioner head laterally movable relative to the platen;
a conditioning disk cleaning station positioned adjacent the platen to clean the conditioner disk; and
a controller configured to cause the motor to
during polishing of the substrate, move the conditioner head back and forth between a first position with the conditioner head over the polishing pad and a second position with the conditioner head in the conditioner disk cleaning station, and
after polishing of the substrate, move the conditioner head to a third position, wherein the third position comprises a cleaning cup configured to contain a cleaning liquid for rinsing or cleaning the conditioner head.