US 12,459,077 B2
Processing method and processing apparatus for workpiece
Toshiya Tsuji, Nagoya (JP); and Yuji Kobayashi, Nagoya (JP)
Assigned to SINTOKOGIO, LTD., Nagoya (JP)
Filed by SINTOKOGIO, LTD., Nagoya (JP)
Filed on Nov. 3, 2022, as Appl. No. 17/980,060.
Claims priority of application No. 2021-182416 (JP), filed on Nov. 9, 2021.
Prior Publication US 2023/0148212 A1, May 11, 2023
Int. Cl. B23K 20/00 (2006.01); B22C 9/12 (2006.01); B24B 39/02 (2006.01)
CPC B24B 39/026 (2013.01) [B22C 9/12 (2013.01); B23K 20/00 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A processing method, comprising:
preparing a metal workpiece having a hole that opens to a surface thereof;
filling the hole with processing media; and
applying an external force to the processing media to plastically deform an inner surface of the hole, thereby applying a compressive residual stress to the inner surface of the hole.