US 12,459,076 B2
Chemical-mechanical polishing subpad having porogens with polymeric shells
Dustin Miller, Beaverton, OR (US); Paul Andre Lefevre, Portland, OR (US); Aaron Peterson, Portland, OR (US); and Chen-Chih Tsai, Naperville, IL (US)
Assigned to CMC MATERIALS LLC, Billerica, MA (US)
Filed by CMC Materials, Inc., Aurora, IL (US)
Filed on Dec. 21, 2021, as Appl. No. 17/557,461.
Claims priority of provisional application 63/128,953, filed on Dec. 22, 2020.
Prior Publication US 2022/0193860 A1, Jun. 23, 2022
Int. Cl. B24B 37/24 (2012.01); B24D 3/32 (2006.01); B29C 44/02 (2006.01)
CPC B24B 37/24 (2013.01) [B24D 3/32 (2013.01); B29C 44/02 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A chemical-mechanical polishing pad comprising:
a subpad supporting a top pad, the subpad comprising a thermoset polyurethane body and a plurality of porogens distributed within the thermoset polyurethane body, the porogens comprising polymeric shells wherein the polymeric shells comprise a material selected from the group consisting of a block copolymer, polyvinylidene chloride, acrylonitrile, and acrylic materials, wherein the subpad has a density of about 150 kg/m3 to about 900 kg/m3 and a compression force deflection of about 25% between 5 psi and 200 psi; and
a top pad having a polishing surface, wherein the top pad is adhered to the subpad with an adhesive.