US 12,459,075 B2
Semiconductor manufacturing device
Yasuhide Okada, Yokkaichi Mie (JP)
Assigned to KIOXIA CORPORATION, Tokyo (JP)
Filed by Kioxia Corporation, Tokyo (JP)
Filed on Jul. 27, 2022, as Appl. No. 17/874,636.
Claims priority of application No. 2022-039794 (JP), filed on Mar. 15, 2022.
Prior Publication US 2023/0294238 A1, Sep. 21, 2023
Int. Cl. B24B 37/10 (2012.01); B24B 37/005 (2012.01); H01L 21/67 (2006.01)
CPC B24B 37/10 (2013.01) [B24B 37/005 (2013.01); H01L 21/67253 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A semiconductor manufacturing device comprising:
a turntable configured to rotate, the turntable having a first surface;
a polishing pad disposed on the first surface;
a first support portion configured to rotatably hold the turntable;
a top ring having a second surface and including a suction mechanism that holds an object to be processed on the second surface;
a second support portion configured to rotatably hold the top ring;
a first member arranged to come into contact with the turntable or top ring;
a second member arranged to come into contact with the polishing pad or suction mechanism and arranged to come into contact with the turntable or top ring via the first member; and
a first acoustic emission (AE) sensor arranged to come into contact with the second member, wherein
the turntable has a third surface facing the first surface, and a second through hole through which the third surface and the first surface communicate with each other,
a part of the first member is provided in the second through hole, and
the second member is in contact with the polishing pad via a third through hole of the first member.