US 12,459,071 B2
Cooling base for a substrate support
Yogananda Sarode Vishwanath, Bangalore (IN); and Anand Kumar, Bangalore (IN)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Jan. 10, 2024, as Appl. No. 18/409,683.
Prior Publication US 2025/0222550 A1, Jul. 10, 2025
Int. Cl. B23Q 11/10 (2006.01); B23Q 3/15 (2006.01)
CPC B23Q 11/10 (2013.01) [B23Q 3/15 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A cooling base comprising:
a top plate having cooling channels formed therein;
a middle plate disposed below the top plate, the middle plate comprising:
a cooling return plenum disposed on a middle layer;
a cooling supply plenum disposed below the middle layer;
a plurality of islands disposed on the middle layer in the cooling return plenum;
a plurality of cooling inlets disposed through the plurality of islands and coupling the cooling supply plenum to the cooling channels; and
a plurality of cooling outlets fluidly coupling the cooling channels to the cooling return plenum; and
a bottom plate disposed below the middle plate, the bottom plate having cooling inlets fluidly coupled to the cooling supply plenum and cooling outlets fluidly coupled to the cooling return plenum.