US 12,459,027 B2
Production method for integrated circuits
Jefferson Ochoa Lugue, Baguio (PH); and Christopher Frederick Abrenica Binegas, Baguio (PH)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed on Jan. 15, 2018, as Appl. No. 15/871,730.
Claims priority of provisional application 62/612,285, filed on Dec. 29, 2017.
Prior Publication US 2019/0201963 A1, Jul. 4, 2019
Int. Cl. H01L 21/56 (2006.01); B21D 28/14 (2006.01); B21D 43/02 (2006.01); B21D 45/00 (2006.01); B21D 45/02 (2006.01); B23P 19/02 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 23/31 (2006.01)
CPC B21D 28/14 (2013.01) [B21D 43/025 (2013.01); B21D 45/003 (2013.01); B21D 45/02 (2013.01); B23P 19/025 (2013.01); H01L 21/561 (2013.01); H01L 24/95 (2013.01); H01L 23/3107 (2013.01); H01L 24/97 (2013.01); H01L 2924/14 (2013.01); H01L 2924/181 (2013.01)] 31 Claims
OG exemplary drawing
 
1. An integrated circuit (IC) production method, comprising:
receiving, by an IC forming machine, a leadframe comprising a plurality of ICs;
singulating, by the IC forming machine, the plurality of ICs;
forming, by the IC forming machine, leads of at least some of the plurality of singulated ICs and
separating, automatically by the IC forming machine, singulated ICs with formed leads having expected dimensions from singulated ICs with formed leads having other than the expected dimensions.