US 12,459,011 B2
Steam treatment stations for chemical mechanical polishing system
Haosheng Wu, San Jose, CA (US); Jianshe Tang, San Jose, CA (US); Hari Soundararajan, Sunnyvale, CA (US); Shou-Sung Chang, Mountain View, CA (US); Hui Chen, San Jose, CA (US); Chih Chung Chou, San Jose, CA (US); Alexander John Fisher, Santa Clara, CA (US); and Paul D. Butterfield, San Jose, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on May 16, 2024, as Appl. No. 18/665,882.
Application 18/665,882 is a division of application No. 17/889,330, filed on Aug. 16, 2022, granted, now 12,030,093.
Application 17/889,330 is a division of application No. 16/886,571, filed on May 28, 2020, granted, now 11,446,711.
Claims priority of provisional application 62/854,305, filed on May 29, 2019.
Prior Publication US 2024/0307928 A1, Sep. 19, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. B08B 3/10 (2006.01); B24B 37/34 (2012.01); H01L 21/67 (2006.01)
CPC B08B 3/106 (2013.01) [B24B 37/34 (2013.01); H01L 21/67051 (2013.01); H01L 21/67248 (2013.01); B08B 2203/007 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A method of steam treatment of a carrier head or a substrate in a chemical mechanical polishing system, comprising:
receiving a carrier head and/or substrate in a substrate loading cup of the chemical mechanical polishing system; and
directing steam onto the carrier head and/or substrate in the loading cup to clean and/or preheat the carrier head and/or substrate.