US 12,459,009 B2
Substrate processing apparatus and substrate processing method
Toru Hirata, Kumamoto (JP); and Yoshinori Ikeda, Kumamoto (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Mar. 27, 2023, as Appl. No. 18/126,497.
Claims priority of application No. 2022-052808 (JP), filed on Mar. 29, 2022.
Prior Publication US 2023/0311170 A1, Oct. 5, 2023
Int. Cl. B08B 3/04 (2006.01); B08B 13/00 (2006.01)
CPC B08B 3/04 (2013.01) [B08B 13/00 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A substrate processing apparatus, comprising:
a substrate holding unit that holds a substrate horizontally;
a processing liquid supply unit that supplies a processing liquid to the substrate that is held horizontally by the substrate holding unit;
a first processing cup that is provided annularly around the substrate holding unit;
a second processing cup that is provided annularly around the substrate holding unit and is provided on an inner side of the first processing cup;
a drain port that is formed on a storage unit where the processing liquid that flows between the first processing cup and the second processing cup is stored;
a first exhaust port that is provided to exhaust a gas between the first processing cup and the second processing cup;
a second exhaust port that is provided on an inner side of the first exhaust port and is provided to exhaust a gas on an inner side of the second processing cup;
a suction port that is provided between the drain port and the first exhaust port in a height direction thereof; and
a sealing member that opens or closes the first exhaust port, wherein the sealing member is located between the first processing cup and the second processing cup.