US 12,459,004 B2
Micromechanical component for a sound transducer and corresponding production method
Jochen Reinmuth, Reutlingen (DE); Daniel Monteiro Diniz Reis, Esslingen am Neckar (DE); and Martin Rambach, Pliezhausen (DE)
Assigned to ROBERT BOSCH GMBH, Stuttgart (DE)
Filed by Robert Bosch GmbH, Stuttgart (DE)
Filed on Sep. 10, 2021, as Appl. No. 17/471,548.
Claims priority of application No. 102020211537.0 (DE), filed on Sep. 15, 2020.
Prior Publication US 2022/0080461 A1, Mar. 17, 2022
Int. Cl. B06B 1/06 (2006.01); B06B 1/02 (2006.01)
CPC B06B 1/0666 (2013.01) [B06B 1/0207 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A micromechanical component for a sound transducer, comprising:
a diaphragm element having a first diaphragm surface and a second diaphragm surface that points away from the first diaphragm surface;
at least one piezoelectric element situated on and/or at the first diaphragm surface, from which the second diaphragm surface points away;
a substrate having at least one control and/or evaluation circuit developed thereon and/or therein, the first diaphragm surface pointing toward the substrate and the second diaphragm surface pointing away from the substrate, the substrate being attached to the diaphragm element at least via at least one an electrically conductive bond connection structure which is developed on and/or at the first diaphragm surface and from which the second diaphragm surface points away;
wherein the at least one piezoelectric element is electrically connected to the at least one control and/or evaluation circuit at least via the at least one electrically conductive bond connection structure,
wherein the at least one electrically conductive bond connection structure is an aluminum-germanium bond connection structure formed on the first diaphragm surface and configured as an interface for eutectic bonding, wherein the eutectic bonding forms a bond frame that surrounds the electrically conductive bond connection structure.