US 12,459,001 B2
Ultrasonic transducer array device
Michael Kraft, Raeren (DE); Robert Puers, Blanden (BE); and Sina Sadeghpour Shamsabadi, Lubbeek (BE)
Assigned to KATHOLIEKE UNIVERSITEIT LEUVEN, Leuven (BE)
Appl. No. 18/037,159
Filed by KATHOLIEKE UNIVERSITEIT LEUVEN, Leuven (BE)
PCT Filed Nov. 19, 2021, PCT No. PCT/EP2021/082335
§ 371(c)(1), (2) Date May 16, 2023,
PCT Pub. No. WO2022/106637, PCT Pub. Date May 27, 2022.
Claims priority of application No. 20208666 (EP), filed on Nov. 19, 2020; application No. 20208670 (EP), filed on Nov. 19, 2020; and application No. 20208676 (EP), filed on Nov. 19, 2020.
Prior Publication US 2024/0024916 A1, Jan. 25, 2024
Int. Cl. B06B 1/02 (2006.01); B06B 1/06 (2006.01)
CPC B06B 1/0292 (2013.01) [B06B 1/0666 (2013.01)] 13 Claims
OG exemplary drawing
 
1. An ultrasonic transducer multilayer structure, comprising:
a semiconductor layer stack defining a diode,
a micro-machined ultrasonic transducer, MUT, layer stack being electrically in series with said diode and comprising a first electrically conductive layer, said MUT layer stack disposed at least partly on said diode,
a cavity extending over a region comprising at least a portion of said semiconductor layer stack and said first electrically conductive layer,
wherein said MUT layer stack comprises a membrane extending at least partly over said region.