US 12,133,372 B2
Pumping capacitor and semiconductor memory device including the same
Yooseok Yang, Suwon-si (KR); and Jongwook Park, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Mar. 1, 2022, as Appl. No. 17/683,562.
Claims priority of application No. 10-2021-0115322 (KR), filed on Aug. 31, 2021.
Prior Publication US 2023/0068172 A1, Mar. 2, 2023
Int. Cl. G11C 11/34 (2006.01); G11C 5/10 (2006.01); G11C 5/14 (2006.01); H01L 49/02 (2006.01); H10B 12/00 (2023.01)
CPC H10B 12/31 (2023.02) [G11C 5/10 (2013.01); G11C 5/14 (2013.01); G11C 5/145 (2013.01); H01L 28/60 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A semiconductor memory device comprising: a plurality of memory cell array banks, each comprising a plurality of memory cells provided in a predetermined pattern between a plurality of sub word lines and a plurality of bit lines on a substrate; and a plurality of pumping voltage generators each comprising at least one pumping capacitor provided in a peripheral circuit area on the substrate, wherein each of the plurality of memory cells comprises an access transistor and a first cell capacitor, wherein the at least one pumping capacitor comprises a first sub pumping capacitor group comprising n second cell capacitors and a second sub pumping capacitor group comprising n third cell capacitors, wherein the first sub pumping capacitor group and the second sub pumping capacitor group are connected in series, wherein i second cell capacitors among the n second cell capacitors of the first sub pumping capacitor group are connected in parallel, (n−i) second cell capacitors of the first sub pumping capacitor group are floated, i third cell capacitors among the n third cell capacitors of the second sub pumping capacitor group are connected in parallel, and (n−i) third cell capacitors of the second sub pumping capacitor group are floated, and wherein n and i are positive integers.