US 12,133,369 B2
Power conversion device
Yuta Yoshimi, Tokyo (JP); Kenta Fujii, Tokyo (JP); Yuji Shirakata, Tokyo (JP); Hiroyuki Yahara, Tokyo (JP); Hiroyuki Kiyonaga, Tokyo (JP); and Tomohito Fukuda, Tokyo (JP)
Assigned to Mitsubishi Electric Corporation, Tokyo (JP)
Appl. No. 17/916,854
Filed by Mitsubishi Electric Corporation, Tokyo (JP)
PCT Filed May 19, 2021, PCT No. PCT/JP2021/018982
§ 371(c)(1), (2) Date Oct. 4, 2022,
PCT Pub. No. WO2021/235485, PCT Pub. Date Nov. 25, 2021.
Claims priority of application No. 2020-088943 (JP), filed on May 21, 2020.
Prior Publication US 2023/0164958 A1, May 25, 2023
Int. Cl. H05K 7/20 (2006.01); H02M 3/00 (2006.01); H02M 3/28 (2006.01); H02M 3/335 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H05K 3/36 (2006.01)
CPC H05K 7/209 (2013.01) [H02M 3/003 (2021.05); H02M 3/33569 (2013.01); H05K 1/181 (2013.01); H02M 3/285 (2013.01); H02M 3/33573 (2021.05); H05K 1/148 (2013.01); H05K 3/366 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A power conversion device comprising:
an electronic component including a first component and a second component;
a first substrate including a first main surface on which the first component of the electronic component is mounted and a second main surface opposed to the first main surface;
a first cooling body thermally connected to the second main surface of the first substrate;
a second substrate including a third main surface on which the second component of the electronic component is mounted and a fourth main surface opposed to the third main surface;
a second cooling body thermally connected to the fourth main surface of the second substrate; and
a wiring member, wherein
the second cooling body extends in a direction from the second main surface of the first substrate toward the first main surface,
the wiring member includes a first wiring member to electrically connect the first substrate and the second substrate to each other,
the power conversion device further comprises a first insulating member arranged between the second main surface of the first substrate and the first cooling body,
on the first main surface of the first substrate, a first joint portion to which the first wiring member is joined is provided,
between the second main surface of the first substrate and the first cooling body, the first insulating member is arranged on a rear surface of at least the first joint portion;
the first substrate is provided on an inner side of the first cooling body, and
the second substrate is provided on an inner side of the second cooling body.