US 12,133,368 B2
Cooling mass and spring element for low insertion force hot swappable electronic component interface
Hardeep Singh, Foslom, CA (US); Rachit Sharma, Vancouver (CA); Timothy Glen Hanna, Tigard, OR (US); and Devdatta P. Kulkarni, Portland, OR (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Mar. 17, 2022, as Appl. No. 17/697,877.
Claims priority of provisional application 63/278,059, filed on Nov. 10, 2021.
Prior Publication US 2022/0210952 A1, Jun. 30, 2022
Int. Cl. H05K 7/20 (2006.01); H05K 7/14 (2006.01)
CPC H05K 7/20772 (2013.01) [H05K 7/1489 (2013.01); H05K 7/20254 (2013.01); H05K 7/20263 (2013.01); H05K 7/2049 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a cooling mass;
a cooling block including an opening to receive a portion of the cooling mass; and
a spring element to be rotated about an axis of rotation, an obstruction between a hot pluggable electronic component and an electro-mechanical connector to be removed by the spring element's rotation, the cooling mass to be pressed toward the hot pluggable electronic component in response to a force induced by the spring element's rotation.