US 12,133,367 B2
PCB heat dissipation assembly and server having same
Xuesong Zhou, Beijing (CN); Jianjun Pan, Beijing (CN); Shizhen Liao, Beijing (CN); Shuhao Zhang, Beijing (CN); and Xudong Wang, Beijing (CN)
Assigned to BITMAIN TECHNOLOGIES INC., Beijing (CN)
Appl. No. 17/636,644
Filed by BITMAIN TECHNOLOGIES INC., Beijing (CN)
PCT Filed Oct. 31, 2019, PCT No. PCT/CN2019/114832
§ 371(c)(1), (2) Date Feb. 18, 2022,
PCT Pub. No. WO2021/081927, PCT Pub. Date May 6, 2021.
Prior Publication US 2022/0272872 A1, Aug. 25, 2022
Int. Cl. H05K 7/20 (2006.01); H05K 1/02 (2006.01)
CPC H05K 7/20727 (2013.01) [H05K 1/0272 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A PCB heat dissipation assembly, comprising:
a PCB board, a plurality of chips being arranged on the PCB board;
at least one heat sink, the heat sink being arranged on the plurality of chips, and the heat sink comprising a heat dissipation air duct; and
an air baffle, the air baffle being arranged adjacent to the at least one heat sink, the air baffle being located on one side of the at least one heat sink, the air baffle extending along the heat dissipation air duct, and the air baffle being in a threaded connection to the PCB board;
wherein at least one mounting bracket and at least one mounting bar are fastened onto the PCB board, the at least one mounting bracket and the at least one mounting bar are spaced apart in a lengthwise direction of the air baffle, the air baffle is in a threaded connection to the mounting bracket, the at least one mounting bar is opposite the bottom of the air baffle, and the at least one mounting bar is arranged between and presses against the air baffle and the PCB board.