US 12,133,364 B2
Photosensitive assembly, camera module and electronic device
Chao Pang, Guangdong (CN); Lingyun Mi, Guangdong (CN); Bin Qin, Guangdong (CN); and Chaoyuan Chan, Guangdong (CN)
Assigned to GUANGZHOU LUXVISIONS INNOVATION TECHNOLOGY LIMITED, Guangdong (CN)
Filed by GUANGZHOU LUXVISIONS INNOVATION TECHNOLOGY LIMITED, Guangdong (CN)
Filed on Sep. 28, 2022, as Appl. No. 17/954,506.
Claims priority of application No. 202220430483.9 (CN), filed on Mar. 1, 2022.
Prior Publication US 2023/0284419 A1, Sep. 7, 2023
Int. Cl. G06F 1/16 (2006.01); H04N 23/55 (2023.01); H05K 5/00 (2006.01); H05K 7/00 (2006.01); H05K 7/20 (2006.01)
CPC H05K 7/20409 (2013.01) [H04N 23/55 (2023.01); H05K 7/205 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A photosensitive assembly, comprising:
a circuit board provided with an accommodation cavity that extends through the circuit board;
a photosensitive element accommodated in the accommodation cavity and electrically connected to the circuit board;
a base disposed on the circuit board; and
an adhesive comprising a first adhesive portion and a second adhesive portion, wherein the first adhesive portion (41) and the second adhesive portion (42) are connected to each other, the first adhesive portion is located in the accommodation cavity, the first adhesive portion (41) is connected to the photosensitive element and the circuit board, the second adhesive portion is located outside the accommodation cavity, the second adhesive portion is disposed on a surface of the circuit board facing the base, and the base is connected to or not connected to the second adhesive portion.