| CPC H05K 7/20263 (2013.01) [B21D 53/022 (2013.01); H05K 7/20172 (2013.01)] | 15 Claims |
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1. A radiator assembly for a liquid cooling system for cooling a computing unit, the radiator assembly comprising:
a first manifold and a second manifold having among them two liquid openings for connecting a radiator in a liquid loop;
channels extending between the first manifold and the second manifold and providing parallel liquid paths between the manifolds;
fin layers sandwiched between sets of neighbouring channels and extending between the first manifold and the second manifold, wherein the fin layers along each of the channels have varying fin densities; and
fastening means for attaching a fan to the radiator in a predetermined position, determining a ring-shaped high-pressure zone corresponding to an outer area of a fan radius of the attached fan, wherein:
at least one fin layer has a low-density section placed away from the high-pressure zone, and a high-density section being located in the high-pressure zone and having a higher fin density than the low-density section;
the density of the group of fin layers thereby varies both along the channels but also transverse of each channel, resulting in two-dimensional density variations across the radiator surface, sections of fins to be positioned in front of the ring-shaped high-pressure zone have a higher density than the section of fins away from the ring-shaped high-pressure zone; and
the fin density is differentiated through each fin layer and thereby adapted to different air speeds or pressures such that the fin density of each fin layer correlates positively with the air speed or pressure at each fin layer.
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