US 12,133,357 B2
Cold plate architecture for liquid cooling of devices
Jin Yang, Hillsboro, OR (US); David Shia, Portland, OR (US); Mohanraj Prabhugoud, Hillsboro, OR (US); Olaotan Elenitoba-Johnson, Tigard, OR (US); Craig Jahne, Beaverton, OR (US); and Phil Geng, Washougal, WA (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Dec. 16, 2020, as Appl. No. 17/123,760.
Claims priority of provisional application 63/036,311, filed on Jun. 8, 2020.
Prior Publication US 2021/0105911 A1, Apr. 8, 2021
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20254 (2013.01) [H05K 7/20418 (2013.01); H05K 7/20509 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a first surface;
a second surface, the first surface to face towards the second surface, the second surface to face towards the first surface;
fins extending from the first surface towards the second surface, the fins including a first fin and a second fin spaced apart from the first fin; and
walls extending from the second surface towards the first surface, the walls including a first wall and a second wall defining and extending continuously along opposite sides of a first channel that extends between the first and second surfaces, the first wall defining a second channel extending along the first channel, the first wall separating the first channel from the second channel, the first and second fins to be within the first channel between the first and second walls, the first channel including a first opening in the second surface, the first opening between the first fin and the second fin, the first opening, the first fin, and the second fin along a length of the first channel, the first channel including a second opening in the second surface, the first fin being closer to the second fin than the second opening is to the second fin.