US 12,133,348 B2
Electronic device including waterproof structure
Sunggun Cho, Gyeonggi-do (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed on Apr. 26, 2022, as Appl. No. 17/729,093.
Application 17/729,093 is a continuation of application No. PCT/KR2022/005701, filed on Apr. 21, 2022.
Claims priority of application No. 10-2021-0068114 (KR), filed on May 27, 2021.
Prior Publication US 2022/0386491 A1, Dec. 1, 2022
Int. Cl. H05K 5/06 (2006.01); H04M 1/02 (2006.01); H05K 5/00 (2006.01); H05K 5/02 (2006.01); H05K 5/03 (2006.01)
CPC H05K 5/062 (2013.01) [H04M 1/0216 (2013.01); H05K 5/0017 (2013.01); H05K 5/0226 (2013.01); H05K 5/03 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a first housing including a first support member;
a second housing including a second support member having at least one through-hole;
a hinge device foldably connecting the first housing to the second housing;
a flexible display disposed to be supported by the first housing and the second housing, the flexible display including: a window layer; a display panel disposed beneath the window layer; and a bending part extending from the display panel and attached to a rear surface of the display panel, the bending part having: an extension part extending outward from the display panel and a control circuit; and a cover member disposed on at least a portion of the extension part so as to cover at least a part of the control circuit and including a conductive layer;
a first waterproof member disposed between the display panel and the second support member so as to surround at least a portion of the bending part;
a second waterproof member disposed between the bending part and the second support member; and
a third waterproof member filled through the at least one through-hole such that the first waterproof member is connected to the second waterproof member,
wherein the cover member comprises an exposed part in which at least a part of the conductive layer is exposed, and the exposed part is disposed so as to at least partially overlap the through-hole.