US 12,133,342 B2
Electronic device including a conductive portion and contact member making contact with substrate
Geuna Lee, Gyeonggi-do (KR); Jinho Lim, Gyeonggi-do (KR); Minsu Jung, Gyeonggi-do (KR); and Kwonho Son, Gyeonggi-do (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed on Jul. 22, 2022, as Appl. No. 17/870,977.
Application 17/870,977 is a continuation of application No. PCT/KR2022/010833, filed on Jul. 22, 2022.
Claims priority of application No. 10-2021-0097279 (KR), filed on Jul. 23, 2021.
Prior Publication US 2023/0021646 A1, Jan. 26, 2023
Int. Cl. H05K 1/18 (2006.01); H04M 1/02 (2006.01); H05K 5/00 (2006.01); H05K 5/02 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01)
CPC H05K 5/0069 (2013.01) [H04M 1/0277 (2013.01); H05K 1/189 (2013.01); H05K 5/0217 (2013.01); H05K 1/0281 (2013.01); H05K 1/147 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/1031 (2013.01); H05K 2201/2009 (2013.01); H05K 2201/2036 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a housing including a conductive portion and a non-conductive portion;
a first substrate;
at least one electronic component disposed on the first substrate;
a second substrate electrically coupled to the first substrate, the second substrate including a first surface facing a first direction and a second surface facing a second direction opposite to the first direction;
at least one contact member disposed between the first surface of the second substrate and the conductive portion of the housing; and
a support member disposed between the first surface of the second substrate and the non-conductive portion of the housing.