US 12,133,339 B2
Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
Yune Kumazawa, Tokyo (JP); Takuya Suzuki, Tokyo (JP); and Seiji Shika, Tokyo (JP)
Assigned to MITSUBISHI GAS CHEMICAL COMPANY, INC., Tokyo (JP)
Appl. No. 17/424,229
Filed by MITSUBISHI GAS CHEMICAL COMPANY, INC., Tokyo (JP)
PCT Filed Jan. 17, 2020, PCT No. PCT/JP2020/001451
§ 371(c)(1), (2) Date Jul. 20, 2021,
PCT Pub. No. WO2020/153246, PCT Pub. Date Jul. 30, 2020.
Claims priority of application No. 2019-008389 (JP), filed on Jan. 22, 2019.
Prior Publication US 2022/0071025 A1, Mar. 3, 2022
Int. Cl. C08F 2/50 (2006.01); C08G 73/10 (2006.01); C08G 73/12 (2006.01); C08J 5/24 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 3/46 (2006.01)
CPC H05K 3/4626 (2013.01) [C08F 2/50 (2013.01); C08G 73/1003 (2013.01); C08G 73/128 (2013.01); C08J 5/24 (2013.01); H05K 1/0366 (2013.01); H05K 1/09 (2013.01); C08J 2379/08 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0358 (2013.01)] 8 Claims
 
1. A resin composition comprising:
a maleimide compound (A) having a transmittance of 5% or more at a wavelength of 405 nm (h-line);
at least one carboxylic acid containing compound (B) selected from a compound represented by the following formula (1), a compound represented by the following formula (2), a compound represented by the following formula (3), and a compound represented by the following formula (4); and
a photo initiator (C) comprising a compound represented by the following formula (8):

OG Complex Work Unit Chemistry
wherein each R5 independently represents a substituent represented by the following formula (9) or a phenyl group:

OG Complex Work Unit Chemistry
wherein -* represents a bonding hand and each R6 independently represents a hydrogen atom or a methyl group;

OG Complex Work Unit Chemistry
wherein each R1 independently represents a hydrogen atom, a hydroxyl group, a carboxy group, an amino group, or an aminomethyl group; each k1 independently represents an integer of 1 to 5; and when the formula (1) has two or more carboxy groups, the formula (1) may be an acid anhydride formed by linking the two or more carboxy groups to each other,

OG Complex Work Unit Chemistry
wherein each R2 independently represents a hydrogen atom, a hydroxyl group, a carboxy group, a carboxymethyl group, an amino group, or an aminomethyl group; each l1 independently represents an integer of 1 to 9; when the formula (2) has two or more carboxy groups, the formula (2) may be an acid anhydride formed by linking the two or more carboxy groups to each other; and when the formula (2) has a carboxymethyl group, the formula (2) may be an acid anhydride formed by linking a carboxymethyl group and a carboxy group to each other,

OG Complex Work Unit Chemistry
wherein each R3 independently represents a hydrogen atom, a hydroxyl group, a carboxy group, a carboxymethyl group, an amino group, or an aminomethyl group; each m1 independently represents an integer of 1 to 9; when the formula (3) has two or more carboxy groups, the formula (3) may be an acid anhydride formed by linking the two or more carboxy groups to each other; and when the formula (3) has a carboxymethyl group, the formula (3) may be an acid anhydride formed by linking a carboxymethyl group and a carboxy group to each other, and

OG Complex Work Unit Chemistry
wherein each R4 independently represents a hydrogen atom, a hydroxyl group, a carboxy group, a carboxymethyl group, an amino group, or an aminomethyl group; each j1 independently represents an integer of 1 to 5; when the formula (4) has one or more carboxy groups, the formula (4) may be an acid anhydride formed by linking a carboxymethyl group and a carboxy group to each other; when the formula (4) has two or more carboxy groups, the formula (4) may be an acid anhydride formed by linking the two or more carboxy groups to each other; and when the formula (4) has two or more carboxymethyl groups, the formula (4) may be an acid anhydride formed by linking the two or more carboxymethyl groups to each other,
wherein the resin composition is light-sensitive and photocurable when exposed with an active energy ray including a wavelength of 405 nm (h-line), and has alkaline developability.