US 12,133,338 B2
Insulated circuit substrate manufacturing method
Yoshiaki Sakaniwa, Saitama (JP); and Toyo Ohashi, Saitama (JP)
Assigned to MITSUBISHI MATERIALS CORPORATION, Tokyo (JP)
Appl. No. 17/913,212
Filed by MITSUBISHI MATERIALS CORPORATION, Tokyo (JP)
PCT Filed Mar. 24, 2021, PCT No. PCT/JP2021/012169
§ 371(c)(1), (2) Date Sep. 21, 2022,
PCT Pub. No. WO2021/193701, PCT Pub. Date Sep. 30, 2021.
Claims priority of application No. 2020-053650 (JP), filed on Mar. 25, 2020.
Prior Publication US 2023/0127557 A1, Apr. 27, 2023
Int. Cl. H05K 1/02 (2006.01); H01L 21/48 (2006.01); H05K 1/03 (2006.01); H05K 3/10 (2006.01); H05K 3/20 (2006.01); H05K 3/44 (2006.01); H05K 3/00 (2006.01)
CPC H05K 3/44 (2013.01) [H01L 21/4846 (2013.01); H05K 1/03 (2013.01); H05K 3/0061 (2013.01); H05K 3/20 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0162 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A manufacturing method for an insulated circuit substrate including an insulating resin layer and a circuit layer consisting of a metal piece arranged in a circuit pattern shape on one surface of the insulating resin layer, the manufacturing method for the insulated circuit substrate comprising:
a metal piece disposing step of disposing the metal piece to form a circuit pattern shape on a resin material to be the insulating resin layer; and
a bonding step of bonding the insulating resin layer and the metal piece by pressurizing and heating the resin material and the metal piece at least in a laminating direction,
wherein in the bonding step, the metal piece and the resin material are pressurized in the laminating direction by a pressurizing jig that includes a cushion material disposed on a side of the metal piece and a guide wall portion disposed at a position facing a peripheral portion of the cushion material, and the peripheral portion of the cushion material is brought into contact with the guide wall portion during pressurization.