US 12,133,336 B2
Systems and methods for additive manufacturing passive resistor-capacitor frequency pass filter (PRC FPF)
Daniel Sokol, Rishon L'etsion (IL)
Assigned to Nano Dimension Technologies, LTD., Nes Ziona (IL)
Appl. No. 18/012,776
Filed by Nano Dimension Technologies, LTD., Nes Ziona (IL); and THE IP LAW FIRM OF GUY LEVI, LLC, Wyckoff, NJ (US)
PCT Filed Jun. 24, 2021, PCT No. PCT/US2021/038996
§ 371(c)(1), (2) Date Dec. 23, 2022,
PCT Pub. No. WO2021/263051, PCT Pub. Date Dec. 30, 2021.
Claims priority of provisional application 63/043,329, filed on Jun. 24, 2020.
Prior Publication US 2023/0269882 A1, Aug. 24, 2023
Int. Cl. H05K 3/12 (2006.01); B29C 64/112 (2017.01); B29C 64/386 (2017.01); B33Y 10/00 (2015.01); B33Y 50/00 (2015.01); H05K 1/16 (2006.01); B29L 31/34 (2006.01); B33Y 80/00 (2015.01)
CPC H05K 3/125 (2013.01) [B29C 64/112 (2017.08); B29C 64/386 (2017.08); H05K 1/162 (2013.01); H05K 1/167 (2013.01); B29L 2031/3425 (2013.01); B33Y 10/00 (2014.12); B33Y 50/00 (2014.12); B33Y 80/00 (2014.12); H05K 2203/013 (2013.01)] 20 Claims
 
1. A method of fabricating a passive resistor/capacitor (RC) frequency pass filter (FPF) comprising:
a. providing an ink jet printing system comprising:
i. a first print head, sized and configured to dispense a dielectric ink composition;
ii. a second print head sized and configured to dispense a conductive ink composition;
iii. a conveyor, operably coupled to the first, and the second print heads configured to convey a substrate included with the system, to each of the first, and the second print heads; and
iv. a computer aided manufacturing (“CAM”) module, in communication with each of the first, and second print heads, the CAM further comprising a central processing module (CPM) including at least one processor in communication with a non-transitory computer readable storage medium configured to store instructions that, when executed by the at least one processor cause the CAM to control the ink-jet printing system, by carrying out steps that comprise: receiving a 3D visualization file representing the frequency pass filter (FPF); and generating a file library having a plurality of files, each file representing a substantially 2D layer for printing the FPF and a metafile representing at least the printing order;
b. providing the dielectric ink composition, and the conductive ink composition;
c. using the CAM module, obtaining from the library a first file representative of the first layer for printing the FPF; the first file comprising printing instructions for a pattern representative of at least one of: the dielectric ink, and the conductive ink;
d. using the first print head, forming the pattern corresponding to the dielectric ink;
e. curing the pattern corresponding to the dielectric ink representation in the 2D layer of the FPE;
f. using the second print head, forming the pattern corresponding to the conductive ink;
g. sintering the pattern corresponding to the conductive ink;
h. using the CAM module, obtaining from the library a subsequent file representative of a subsequent layer for printing the FPF; the subsequent file comprising printing instructions for a pattern representative of at least one of: the dielectric ink, and the conductive ink;
i. repeating the steps of: using the first print head, forming the pattern corresponding to the dielectric ink, to the step of using the CAM module, obtaining from the 2D file library the subsequent, substantially 2D layer, wherein upon sintering of the conductive ink pattern in a final layer, the passive RC FPF comprises:
i. a plurality of resistors disposed in an intermediate layer configured in series with at least one transmission load trace;
ii. a plurality of capacitors disposed in an intermediate layer configured in parallel with the at least one transmission load trace, the plurality of capacitors are sized and operable to provide a predetermined cut-off frequency; and
iii. the at least one transmission load trace sized and configured to operably couple to each of the plurality of capacitors, and each of the plurality of resistors; and
j. removing the substrate from the FPF.