US 12,133,329 B2
Printed circuit board and method for manufacturing the same
Su Min Song, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Jun. 28, 2022, as Appl. No. 17/851,570.
Claims priority of application No. 10-2021-0190972 (KR), filed on Dec. 29, 2021.
Prior Publication US 2023/0209710 A1, Jun. 29, 2023
Int. Cl. H05K 1/11 (2006.01); H05K 3/42 (2006.01)
CPC H05K 1/113 (2013.01) [H05K 3/429 (2013.01); H05K 2201/096 (2013.01); H05K 2201/09827 (2013.01); H05K 2203/0554 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A printed circuit board comprising:
an insulating member;
a first pad disposed in the insulating member;
a plurality of first vias respectively disposed on a lower side of the first pad in the insulating member and connected to the first pad;
a second via disposed on an upper side of the first pad in the insulating member and connected to the first pad;
a plurality of second pads disposed on lower sides of the plurality of first vias in the insulating member and connected to the plurality of first vias; and
one or more lines disposed on substantially the same level as the plurality of second pads in the insulating member and disposed between the plurality of second pads,
wherein the first pad has one or more through-holes, and
the plurality of first vias and the second via are integrated as one body through the one or more through-holes.