US 12,133,327 B2
Patterned article including electrically conductive elements
Raymond P. Johnston, Lake Elmo, MN (US); John J. Sullivan, Hudson, WI (US); Matthew C. Messina, Maplewood, MN (US); Charles D. Hoyle, Stillwater, MN (US); Jaewon Kim, Woodbury, MN (US); Haiyan Zhang, Lake Elmo, MN (US); Matthew S. Stay, Bloomington, MN (US); Robert A. Sainati, Bloomington, MN (US); Kevin W. Gotrik, Hudson, WI (US); Kenneth A. P. Meyer, Eagan, MN (US); Gregory L. Abraham, Austin, TX (US); Joseph C. Carls, Austin, TX (US); and Douglas S. Dunn, Woodbury, MN (US)
Assigned to 3M INNOVATIVE PROPERTIES COMPANY, St. Paul, MN (US)
Appl. No. 17/602,659
Filed by 3M INNOVATIVE PROPERTIES COMPANY, St. Paul, MN (US)
PCT Filed May 5, 2020, PCT No. PCT/US2020/031450
§ 371(c)(1), (2) Date Oct. 8, 2021,
PCT Pub. No. WO2020/227280, PCT Pub. Date Nov. 12, 2020.
Claims priority of provisional application 62/843,739, filed on May 6, 2019.
Prior Publication US 2022/0183153 A1, Jun. 9, 2022
Int. Cl. H05K 1/02 (2006.01); H01Q 1/38 (2006.01); H05K 1/03 (2006.01); H05K 3/00 (2006.01); H05K 3/10 (2006.01); H05K 3/20 (2006.01); H05K 3/24 (2006.01); H05K 3/46 (2006.01)
CPC H05K 1/0296 (2013.01) [H01Q 1/38 (2013.01); H05K 1/0353 (2013.01); H05K 3/0014 (2013.01); H05K 3/103 (2013.01); H05K 3/207 (2013.01); H05K 3/244 (2013.01); H05K 3/4644 (2013.01); H05K 2201/09118 (2013.01); H05K 2203/0108 (2013.01); H05K 2203/0152 (2013.01); H05K 2203/0156 (2013.01); H05K 2203/0723 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A patterned article comprising:
a unitary polymeric layer; and
a plurality of electrically conductive elements embedded at least partially in the unitary polymeric layer and being electrically isolated from one another, each electrically conductive element comprising:
a conductive seed layer having a top major surface and an opposite bottom major surface in direct contact with the unitary polymeric layer, the conductive seed layer comprising a monolithic metal layer; and
a metallic body disposed on the top major surface of the conductive seed layer, the metallic body having a bottom major surface and at least one sidewall, the bottom major surface contacting the conductive seed layer, each sidewall being in direct contact with the unitary polymeric layer and extending from the bottom major surface of the metallic body toward or to, but not past, a top major surface of the unitary polymeric layer, wherein at least some of the electrically conductive elements comprise a micropattern of conductive traces having an open area fraction in a range of 80% to 99.95%.