US 12,133,326 B2
Extensible and contractible wiring board and method for manufacturing extensible and contractible wiring board
Takayoshi Obata, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Nagaokakyo (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Sep. 1, 2023, as Appl. No. 18/459,989.
Application 18/459,989 is a division of application No. 17/318,150, filed on May 12, 2021, granted, now 11,785,714.
Application 17/318,150 is a continuation of application No. PCT/JP2019/022942, filed on Jun. 10, 2019.
Claims priority of application No. 2018-219247 (JP), filed on Nov. 22, 2018.
Prior Publication US 2023/0413428 A1, Dec. 21, 2023
Int. Cl. H05K 1/02 (2006.01); A61L 27/44 (2006.01); A61L 27/60 (2006.01); B32B 5/00 (2006.01); B32B 5/12 (2006.01); B32B 5/14 (2006.01); H01B 11/18 (2006.01); H01L 41/16 (2006.01); H01L 41/18 (2006.01); H05K 1/03 (2006.01); H05K 3/00 (2006.01); H05K 3/20 (2006.01); H05K 3/46 (2006.01)
CPC H05K 1/0283 (2013.01) [H05K 3/20 (2013.01); H05K 3/4611 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A method for manufacturing an extensible and contractible wiring board, the method comprising:
applying a first tensile stress to an extensible and contractible wiring sheet that includes an extensible and contractible resin sheet and an extensible and contractible wiring formed on the extensible and contractible resin sheet;
relaxing the first tensile stress;
applying a second tensile stress to the extensible and contractible wiring sheet after relaxing the first tensile stress; and
securing a fixing sheet to a main surface of the extensible and contractible wiring sheet in a state in which the second tensile stress is applied.