US 12,133,049 B2
Reduced light reflection package
Roberto Brioschi, Austin, TX (US); Kazunori Hayata, Cupertino, CA (US); Jr-Cheng Yeh, Taoyuan (TW); and Dinesh Kumar Solanki, Santa Clara, CA (US)
Assigned to InvenSense, Inc., San Jose, CA (US)
Filed by InvenSense, Inc., San Jose, CA (US)
Filed on Sep. 22, 2023, as Appl. No. 18/371,488.
Application 18/371,488 is a continuation of application No. 17/494,120, filed on Oct. 5, 2021, granted, now 11,800,297.
Claims priority of provisional application 63/126,348, filed on Dec. 16, 2020.
Prior Publication US 2024/0015447 A1, Jan. 11, 2024
Int. Cl. H04R 19/04 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01); H04R 1/04 (2006.01); H04R 3/00 (2006.01)
CPC H04R 19/04 (2013.01) [B81B 7/0064 (2013.01); B81C 1/00333 (2013.01); H04R 1/04 (2013.01); H04R 3/00 (2013.01); B81B 2201/0257 (2013.01); B81B 2201/0264 (2013.01); B81B 2201/0271 (2013.01); B81B 2201/0292 (2013.01); B81B 2203/0127 (2013.01); B81B 2207/015 (2013.01); B81C 2203/0109 (2013.01); H04R 2201/003 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A microelectromechanical system (MEMS) sensor package, comprising:
a substrate;
a MEMS diaphragm disposed over the substrate; and
a lid, wherein the lid and the substrate define a cavity at least partially surrounding the MEMS diaphragm, wherein the lid comprises:
a light mitigation structure; and
a port hole located in the lid and providing a through hole to allow a signal to be received by the MEMS diaphragm, wherein the MEMS diaphragm defines a first surface area, and wherein a second surface area of a portion of the light mitigation structure that is parallel to and facing the MEMS diaphragm is greater than the first surface area such that the second surface area surrounds a projection of the first surface area.