US 12,133,044 B2
Headphone sealing cup
Anders Røser Hansen, Ballerup (DK); Peter Vestergaard Værum, Ballerup (DK); Klaus Sommer Ipsen, Vanløse (DK); Johan Grundtvig, Brønshøj (DK); Morten Hessilt Kjær, Ballerup (DK); and Giovanni Ferranti, Ballerup (DK)
Assigned to EPOS Group A/S, Ballerup (DK)
Filed by EPOS Group A/S, Ballerup (DK)
Filed on Apr. 26, 2023, as Appl. No. 18/307,029.
Application 18/307,029 is a continuation of application No. 17/488,808, filed on Sep. 29, 2021, granted, now 11,678,104.
Claims priority of application No. 20199138 (EP), filed on Sep. 30, 2020.
Prior Publication US 2023/0328424 A1, Oct. 12, 2023
Int. Cl. H04R 1/10 (2006.01)
CPC H04R 1/1083 (2013.01) [H04R 1/1008 (2013.01)] 12 Claims
OG exemplary drawing
 
1. An earcup for a headset, the earcup comprising:
a front opening adapted to be adjacent to the ear of a user of the headset;
a baffle disposed within the earcup to define a front cavity and a rear cavity;
an outer cup having a first back wall and first side walls, the outer cup arranged to accommodate the rear cavity;
an inner cup having a second back wall and second side walls, the inner cup arranged within the rear cavity surrounding the front opening; and
an intermediary cup having a third back wall and third side walls, the intermediary cup arranged between the outer cup and the first inner cup;
wherein the first back wall, the second back wall, and the third back wall are different surfaces.