US 12,132,507 B2
Radio-frequency module and communication device
Atsushi Horita, Nagaokakyo (JP); Yukiya Yamaguchi, Nagaokakyo (JP); Morio Takeuchi, Nagaokakyo (JP); Shigeru Tsuchida, Nagaokakyo (JP); Tomoaki Sato, Nagaokakyo (JP); and Rui Tanaka, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO. , LTD., Nagaokakyo (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Jun. 14, 2021, as Appl. No. 17/346,308.
Claims priority of application No. 2020-122418 (JP), filed on Jul. 16, 2020.
Prior Publication US 2022/0021404 A1, Jan. 20, 2022
Int. Cl. H04B 1/00 (2006.01); H03F 1/02 (2006.01); H03F 3/21 (2006.01); H03F 3/24 (2006.01); H04B 1/04 (2006.01); H04W 52/52 (2009.01)
CPC H04B 1/006 (2013.01) [H03F 3/245 (2013.01); H04B 1/0057 (2013.01); H04W 52/52 (2013.01); H03F 2200/294 (2013.01); H03F 2200/451 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A radio-frequency module comprising:
a mounting substrate having a first main surface and a second main surface on opposite sides of the mounting substrate;
a first power amplifier that is mounted on the first main surface of the mounting substrate;
a second power amplifier that is mounted on the first main surface of the mounting substrate;
a circuit component, which is different from the first power amplifier and the second power amplifier, is mounted on the second main surface of the mounting substrate; and
an external connection terminal that is
disposed on the second main surface of the mounting substrate,
connected to a power supply that supplies a power supply voltage to the first power amplifier and the second power amplifier, and
connected to both the first power amplifier and the second power amplifier, wherein
the external connection terminal is disposed between an outer peripheral surface, which is on an opposite side from the second power amplifier, of the first power amplifier and an outer peripheral surface, which is on an opposite side from the first power amplifier, of the second power amplifier in plan view in a direction that intersects both a thickness direction of the mounting substrate and a direction in which the first power amplifier and the second power amplifier are arrayed.