US 12,132,469 B2
Galvanically isolated driver package for switch drive circuit with power transfer
Andrew Thompson, Cheshire (GB); Joe Duigan, Peymeinade (FR); and Karl Rinne, Cork (GB)
Assigned to Allegro MicroSystems, LLC, Manchester, NH (US)
Filed by Allegro MicroSystems, LLC, Manchester, NH (US)
Filed on Jun. 1, 2021, as Appl. No. 17/336,005.
Claims priority of application No. 2008310 (GB), filed on Jun. 2, 2020.
Prior Publication US 2021/0376822 A1, Dec. 2, 2021
Int. Cl. H01F 27/28 (2006.01); H01F 5/04 (2006.01); H01F 17/00 (2006.01); H01F 27/00 (2006.01); H01F 27/02 (2006.01); H01F 27/40 (2006.01); H01F 41/04 (2006.01); H03K 17/0424 (2006.01); H03K 17/691 (2006.01)
CPC H03K 17/0424 (2013.01) [H01F 5/04 (2013.01); H01F 17/00 (2013.01); H01F 27/00 (2013.01); H01F 27/02 (2013.01); H01F 27/027 (2013.01); H01F 27/28 (2013.01); H01F 27/2895 (2013.01); H01F 27/40 (2013.01); H01F 41/04 (2013.01); H03K 17/691 (2013.01)] 12 Claims
OG exemplary drawing
 
1. An isolated gate drive comprising:
a transformer having a core, a primary winding and a secondary winding;
a substrate having a first major surface and a second major surface opposing the first major surface;
a first insulating material provided on said substrate, the first insulating material in combination with the first major surface of the substrate defining a well, wherein the first insulating material covers the first major surface outside of the well;
wherein the core is disposed within the well and one or both of the primary and secondary windings are partially formed by one or more wirebond wires bonded to landing zones on the first major surface; and
a second insulating material disposed in the well and covering the wirebond wires and core, wherein the second insulating material is softer than the first insulating material.