CPC H02K 5/02 (2013.01) [H02K 5/08 (2013.01); H02K 15/12 (2013.01)] | 4 Claims |
1. In an EC motor having an electronic controller, a method for encapsulating the electronic controller with an epoxy where certain parts of the electronic controller are encapsulated and other parts of the electronic controller are not encapsulated, the method comprising the steps of:
a. creating a two-part silicone mold having a first mold part and a second mold part, wherein each of the mold parts when joined together creates voids for surrounding and encapsulating certain parts and no voids surrounding other parts that are not to be encapsulated;
b. injecting the epoxy into the voids for encapsulating the certain parts while leaving the other parts free of the epoxy; and
c. subjecting the silicone mold, the epoxy, and the electronic controller to a negative pressure to remove air bubbles from the epoxy and to heat in order to cure the epoxy.
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