US 12,132,183 B2
Mechanical and thermal system for a modular battery with power electronics components
Stefan Götz, Forstern (DE); Malte Jaensch, Bietigheim-Bissingen (DE); David Kuhn, Uhingen (DE); Patrick Leidig, Stuttgart (DE); and Tim Schmidt, Freiberg am Neckar (DE)
Assigned to Dr. Ing. h.c. F. Porsche Aktiengesellschaft, (DE)
Appl. No. 16/971,001
Filed by Dr. Ing. h.c. F. Porsche Aktiengesellschaft, Stuttgart (DE)
PCT Filed Sep. 13, 2018, PCT No. PCT/EP2018/025234
§ 371(c)(1), (2) Date Aug. 19, 2020,
PCT Pub. No. WO2019/161876, PCT Pub. Date Aug. 29, 2019.
Claims priority of application No. 102018103713.9 (DE), filed on Feb. 20, 2018.
Prior Publication US 2021/0005855 A1, Jan. 7, 2021
Int. Cl. H01M 10/42 (2006.01); B60L 50/64 (2019.01); B60L 58/26 (2019.01); H01M 10/613 (2014.01); H01M 10/625 (2014.01); H01M 10/647 (2014.01); H01M 10/6554 (2014.01); H01M 10/6556 (2014.01); H01M 10/667 (2014.01); H01M 50/20 (2021.01); H01M 50/209 (2021.01); H01M 50/211 (2021.01); H01M 50/213 (2021.01); H01M 50/284 (2021.01)
CPC H01M 10/647 (2015.04) [B60L 50/64 (2019.02); B60L 58/26 (2019.02); H01M 10/425 (2013.01); H01M 10/613 (2015.04); H01M 10/625 (2015.04); H01M 10/6554 (2015.04); H01M 10/6556 (2015.04); H01M 10/667 (2015.04); H01M 50/20 (2021.01); H01M 50/209 (2021.01); H01M 50/211 (2021.01); H01M 50/213 (2021.01); H01M 50/284 (2021.01); H01M 2220/20 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A method for producing a mechanical and thermal system for a modular battery, the system having at least one module including (i) a box-like module housing, (ii) at least one energy storage unit, and (iii) at least one power electronics unit arranged on a flat power electronics circuit board and constituting a modular multilevel converter, said method comprising:
connecting the at least one module, on at least one thermally conductive module side, to at least one flat cooling apparatus;
forming a first thermal pathway connecting the at least one energy storage unit to the at least one flat cooling apparatus via at least one first thermally conductive element;
forming a second thermal pathway connecting the at least one power electronics unit to the at least one flat cooling apparatus via at least one second thermally conductive element;
wherein the first thermal pathway and second thermal pathway are discrete from one another;
integrating the at least one energy storage unit and the at least one power electronics unit into the module housing;
connecting the at least one energy storage unit to the at least one first thermally conductive element that contacts the at least one module side connected to the at least one flat cooling apparatus;
arranging the at least one flat power electronics circuit board between the at least one energy storage unit and a housing interior wall of the module housing;
arranging the at least one flat power electronics circuit board between two thermally conductive plates of the at least one second thermally conductive element; and
positioning the two thermally conductive plates of the at least one second thermally conductive element within the module housing such that (i) one of the two thermally conductive plates is arranged between the at least one flat power electronics circuit board and the at least one energy storage unit, (ii) the two thermally conductive plates directly contact at least one module side connected to the at least one flat cooling apparatus, (iii) the two thermally conductive plates are oriented orthogonal to both the first thermally conductive element and the at least one energy storage unit, and (iv) the two thermally conductive plates overlap the at least one energy storage unit and further energy storage units that are stacked together along a stacking axis.