US 12,132,159 B2
Light emitting diode (LED) package and illuminating device including the same
Jongho Lim, Suwon-si (KR); Myoungsu Chae, Hwaseong-si (KR); Yeonjun Sung, Hwaseong-si (KR); Hyongsik Won, Yongin-si (KR); Joonwoo Jeon, Seoul (KR); and Soonwon Jeong, Hwaseong-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Jan. 3, 2022, as Appl. No. 17/567,671.
Claims priority of application No. 10-2021-0004924 (KR), filed on Jan. 13, 2021.
Prior Publication US 2022/0223774 A1, Jul. 14, 2022
Int. Cl. H01L 33/50 (2010.01); H01L 33/62 (2010.01); H05K 1/11 (2006.01)
CPC H01L 33/62 (2013.01) [H05K 1/111 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A light-emitting diode (LED) package comprising:
a package substrate;
an LED chip disposed on a first surface of the package substrate; and
a first external connection pad and a second external connection pad disposed on a second surface of the package substrate opposite the first surface,
wherein the first external connection pad comprises a first side, a second side, a third side and a fourth side, the first side being parallel to the second side, and the third side being parallel to the fourth side,
wherein the first side is spaced farther from a center of the package substrate than the second side, and
wherein a length of the first side is shorter than a length of the second side.