US 12,132,153 B2
LED package structure and method of manufacturing the same, and LED display
Chien-Shou Liao, New Taipei (TW)
Assigned to Skiileux Electricity Inc., Taoyuan (TW)
Filed by Skiileux Electricity Inc., Taoyuan (TW)
Filed on Jul. 5, 2021, as Appl. No. 17/367,596.
Claims priority of application No. 109122750 (TW), filed on Jul. 6, 2020.
Prior Publication US 2022/0005984 A1, Jan. 6, 2022
Int. Cl. H01L 33/50 (2010.01); H01L 27/15 (2006.01); H01L 33/00 (2010.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01)
CPC H01L 33/504 (2013.01) [H01L 27/156 (2013.01); H01L 33/005 (2013.01); H01L 33/486 (2013.01); H01L 33/62 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0066 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A light-emitting diode (LED) package structure, comprising:
an LED chip having two exposed conductive pads;
a quantum dot material layer enclosing the LED chip; and
a blue light scattering material layer disposed on the quantum dot material layer,
wherein a bottom surface of the blue light scattering material layer and a bottom side of the LED chip are flush with each other.