US 12,132,064 B2
Camera package, method for manufacturing camera package, and electronic device
Hiroyasu Matsugai, Kanagawa (JP); and Kotaro Nishimura, Kanagawa (JP)
Assigned to SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Appl. No. 17/430,578
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
PCT Filed Feb. 18, 2020, PCT No. PCT/JP2020/006166
§ 371(c)(1), (2) Date Aug. 12, 2021,
PCT Pub. No. WO2020/171037, PCT Pub. Date Aug. 27, 2020.
Claims priority of application No. 2019-030169 (JP), filed on Feb. 22, 2019.
Prior Publication US 2022/0130880 A1, Apr. 28, 2022
Int. Cl. H01L 21/00 (2006.01); G02B 5/00 (2006.01); G02B 7/02 (2021.01); H01L 27/146 (2006.01); G02B 1/113 (2015.01)
CPC H01L 27/14627 (2013.01) [G02B 5/003 (2013.01); G02B 7/02 (2013.01); H01L 27/14618 (2013.01); H01L 27/1462 (2013.01); H01L 27/14623 (2013.01); H01L 27/14629 (2013.01); H01L 27/14685 (2013.01); G02B 1/113 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A camera package, comprising:
a solid-state imaging element;
a transparent substrate that protects the solid-state imaging element, wherein the transparent substrate includes:
a lens formation region; and
a lens free region around the lens formation region;
a lens on the transparent substrate, wherein the lens is in the lens formation region; and
a plurality of micro-irregularities in the lens free region, wherein a contact angle of the lens free region is different from a contact angle of the lens formation region.