US 12,132,062 B2
Image sensor substrate
Jung Shik Baik, Seoul (KR); Eun Sung Seo, Seoul (KR); Young Joon Son, Seoul (KR); Jee Heum Paik, Seoul (KR); and Hae Sik Kim, Seoul (KR)
Assigned to LG INNOTEK CO., LTD., Seoul (KR)
Appl. No. 17/436,484
Filed by LG INNOTEK CO., LTD., Seoul (KR)
PCT Filed Mar. 3, 2020, PCT No. PCT/KR2020/002982
§ 371(c)(1), (2) Date Sep. 3, 2021,
PCT Pub. No. WO2020/180078, PCT Pub. Date Sep. 10, 2020.
Claims priority of application No. 10-2019-0024661 (KR), filed on Mar. 4, 2019; and application No. 10-2019-0107737 (KR), filed on Aug. 30, 2019.
Prior Publication US 2022/0190015 A1, Jun. 16, 2022
Int. Cl. H01L 27/146 (2006.01); H01L 23/498 (2006.01); G02B 7/08 (2021.01); H01F 7/126 (2006.01); H01F 7/129 (2006.01); H01F 7/17 (2006.01); H04N 23/54 (2023.01); H04N 23/68 (2023.01)
CPC H01L 27/14618 (2013.01) [H01L 23/49838 (2013.01); G02B 7/08 (2013.01); H01F 7/126 (2013.01); H01F 7/129 (2013.01); H01F 7/17 (2013.01); H04N 23/54 (2023.01); H04N 23/687 (2023.01)] 20 Claims
OG exemplary drawing
 
1. An image sensor substrate comprising:
an insulating layer including a first open region; and
a first lead pattern part disposed on the insulating layer,
wherein the first lead pattern part includes:
a first portion disposed on the insulating layer;
a second portion extending from the first portion; and
a third portion connected to the first portion through the second portion,
wherein the second portion is disposed to fly on a region not overlapped with the insulating layer in a vertical direction, and
wherein the third portion is flown with the second portion, the third portion having a first insertion hole configured to allow a wire to extend therethrough.