Paul J Schuele, Washougal, WA (US); Kenji Sasaki, West Lynn, OR (US); Kurt Ulmer, Vancouver, WA (US); and Jong-Jan Lee, Camas, WA (US)
Assigned to eLux, Inc., Vancouver, WA (US)
Filed by eLux Inc., Vancouver, WA (US)
Filed on Jan. 8, 2024, as Appl. No. 18/406,849.
Application 18/406,849 is a continuation of application No. 17/101,016, filed on Nov. 23, 2020, granted, now 11,894,350.
Application 17/101,016 is a continuation in part of application No. 16/875,994, filed on May 16, 2020, granted, now 11,296,059.
Application 16/875,994 is a continuation in part of application No. 16/846,493, filed on Apr. 13, 2020, granted, now 11,251,166.
Application 16/846,493 is a continuation in part of application No. 16/727,186, filed on Dec. 26, 2019, granted, now 11,145,787.
Application 16/727,186 is a continuation in part of application No. 16/406,196, filed on May 8, 2019, granted, now 10,643,981.
Application 16/406,196 is a continuation in part of application No. 16/406,080, filed on May 8, 2019, granted, now 10,804,426.
Application 16/406,080 is a continuation in part of application No. 16/125,671, filed on Sep. 8, 2018, granted, now 10,516,084, issued on Dec. 24, 2019.
Application 16/125,671 is a continuation in part of application No. 15/838,536, filed on Dec. 12, 2017, granted, now 10,242,977, issued on Mar. 26, 2019.
Application 15/838,536 is a continuation in part of application No. 15/722,037, filed on Oct. 2, 2017, granted, now 10,543,486, issued on Jan. 28, 2020.
Application 15/722,037 is a continuation in part of application No. 15/691,976, filed on Aug. 31, 2017, granted, now 10,535,640, issued on Jan. 14, 2020.
Application 15/691,976 is a continuation in part of application No. 15/440,735, filed on Feb. 23, 2017, granted, now 10,381,335, issued on Aug. 13, 2019.
Application 15/440,735 is a continuation in part of application No. 15/416,882, filed on Jan. 26, 2017, granted, now 10,446,728, issued on Nov. 15, 2019.
Application 15/416,882 is a continuation in part of application No. 15/413,053, filed on Jan. 23, 2017, granted, now 10,520,769, issued on Dec. 31, 2019.
Application 15/413,053 is a continuation in part of application No. 15/412,731, filed on Jan. 23, 2017, granted, now 10,418,527, issued on Sep. 17, 2019.
Application 15/412,731 is a continuation in part of application No. 15/410,195, filed on Jan. 19, 2017, granted, now 10,236,279, issued on Mar. 19, 2019.
Application 15/410,195 is a continuation in part of application No. 15/410,001, filed on Jan. 19, 2017, granted, now 9,825,202, issued on Nov. 21, 2017.
Application 15/410,001 is a continuation in part of application No. 14/749,569, filed on Jun. 24, 2015, granted, now 9,722,145, issued on Aug. 1, 2017.
Application 15/410,001 is a continuation in part of application No. 15/221,571, filed on Jul. 27, 2016, granted, now 9,755,110, issued on Sep. 5, 2017.
Application 15/410,001 is a continuation in part of application No. 15/197,266, filed on Jun. 29, 2016, granted, now 10,249,599, issued on Apr. 2, 2019.
Application 15/410,001 is a continuation in part of application No. 15/190,813, filed on Jun. 23, 2016, granted, now 9,892,944, issued on Feb. 13, 2018.
Application 15/410,001 is a continuation in part of application No. 15/158,556, filed on May 18, 2016, granted, now 9,985,190, issued on May 29, 2018.
Application 15/410,001 is a continuation in part of application No. 15/266,796, filed on Sep. 15, 2016, granted, now 9,917,226, issued on Mar. 13, 2018.
Application 14/749,569 is a continuation in part of application No. 14/680,618, filed on Apr. 7, 2015, granted, now 10,115,862, issued on Oct. 30, 2018.
Application 14/680,618 is a continuation in part of application No. 14/530,230, filed on Oct. 31, 2014, abandoned.
1. A micro light emitting diode (microLED) mass transfer method, the method comprising:
fabricating microLEDs on a wafer;
forming a keel extending from an exposed bottom surface of each microLED;
releasing the microLEDs from the wafer into a suspension;
fluidically depositing the microLEDs onto a carrier substrate having a planar top surface and an array of wells formed in the carrier substrate top surface;
transferring the microLEDs on the carrier substrate to a mass transfer stamp by pressing a top surface of the mass transfer stamp substrate against the carrier substrate top surface, with an array of mass transfer stamp capture sites formed in the mass transfer stamp top surface interfacing with corresponding microLEDs in carrier substrate wells; and,
transferring the microLEDs from the mass transfer stamp to a display substrate.
