US 12,132,020 B2
Low temperature bonded structures
Cyprian Emeka Uzoh, San Jose, CA (US); Jeremy Alfred Theil, Mountain View, CA (US); Rajesh Katkar, Milpitas, CA (US); Guilian Gao, San Jose, CA (US); and Laura Wills Mirkarimi, Sunol, CA (US)
Assigned to Adeia Semiconductor Bonding Technologies Inc., San Jose, CA (US)
Filed by ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC., San Jose, CA (US)
Filed on Dec. 13, 2023, as Appl. No. 18/539,143.
Application 18/539,143 is a division of application No. 17/559,485, filed on Dec. 22, 2021.
Application 17/559,485 is a continuation of application No. 16/655,002, filed on Oct. 16, 2019, granted, now 11,244,916, issued on Feb. 8, 2022.
Application 16/655,002 is a continuation in part of application No. 16/363,894, filed on Mar. 25, 2019, granted, now 10,790,262, issued on Sep. 29, 2020.
Claims priority of provisional application 62/656,264, filed on Apr. 11, 2018.
Prior Publication US 2024/0113059 A1, Apr. 4, 2024
Int. Cl. H01L 23/00 (2006.01)
CPC H01L 24/08 (2013.01) [H01L 24/80 (2013.01); H01L 2224/08057 (2013.01); H01L 2224/08147 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A microelectronic assembly, comprising:
a first substrate having a first surface;
a second substrate having a second surface, the first surface of the first substrate intimately bonded to the second surface of the second substrate; and
a bonded conductive interconnect disposed at the first surface and the second surface, the bonded conductive interconnect comprising at least a first conductive material embedded into the first substrate, a second conductive material embedded into the second substrate, and an electrically conductive fill region disposed between the first conductive material and the second conductive material, wherein the fill region comprises a non-linear mass that includes a third conductive material, and wherein the third conductive material has a higher melting point than a melting point of the first conductive material or the second conductive material.