CPC H01L 23/585 (2013.01) [H01L 21/74 (2013.01); H01L 23/562 (2013.01); H01L 23/564 (2013.01)] | 11 Claims |
1. A semiconductor device, comprising:
a semiconductor substrate;
an integrated circuit region formed in the semiconductor substrate; and
a seal ring arranged in the semiconductor substrate and around the integrated circuit region, which configured to protect the integrated circuit region, wherein the seal ring has a wavy structure;
wherein the seal ring comprises a plurality of crest portions and a plurality of trough portions, the plurality of crest portions and the plurality of trough portions being arranged alternately;
wherein at least two seal rings are provided, one of two adjacent ones of the seal rings comprises a plurality of fingers, and the finger extends towards a direction of the other seal ring; and
wherein the plurality of fingers are arranged at vertices of the plurality of crest portions respectively, or the plurality of fingers are arranged at bottom points of the plurality of trough portions respectively.
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8. A semiconductor device manufacturing method, comprising:
providing a semiconductor substrate having an integrated circuit region;
forming a trench on the semiconductor substrate, the trench being arranged around the integrated circuit region; and
forming a seal ring in the trench, the seal ring having a wavy structure;
wherein the seal ring comprises a plurality of crest portions and a plurality of trough portions, the plurality of crest portions and the plurality of trough portions being arranged alternately;
wherein at least two seal rings are provided, one of two adjacent ones of the seal rings comprises a plurality of fingers, and the finger extends towards a direction of the other seal ring; and
wherein the plurality of fingers are arranged at vertices of the plurality of crest portions respectively, or the plurality of fingers are arranged at bottom points of the plurality of trough portions respectively.
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