US 12,132,005 B2
Supports for thinned semiconductor substrates and related methods
Michael J. Seddon, Gilbert, AZ (US); and Francis J. Carney, Mesa, AZ (US)
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed by SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed on Nov. 13, 2023, as Appl. No. 18/507,176.
Application 18/507,176 is a continuation of application No. 16/862,270, filed on Apr. 29, 2020, granted, now 11,854,995.
Prior Publication US 2024/0079343 A1, Mar. 7, 2024
Int. Cl. H01L 23/544 (2006.01); H01L 23/14 (2006.01); H01L 23/32 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/544 (2013.01) [H01L 23/145 (2013.01); H01L 23/32 (2013.01); H01L 25/0655 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor substrate comprising:
a wafer comprising a first side and a second side; and
a support structure separate from a material of the wafer coupled to the wafer at a desired location on the first side, the second side, or both the first side and the second side;
wherein the wafer is undiced;
wherein the support structure comprises an organic compound; and
wherein the support structure comprises a plurality of openings therein.