US 12,132,004 B2
Semiconductor devices and methods of manufacture
Chih-Hao Chen, Taipei (TW); Pu Wang, Hsinchu (TW); Li-Hui Cheng, New Taipei (TW); and Szu-Wei Lu, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Aug. 10, 2022, as Appl. No. 17/818,797.
Application 17/818,797 is a division of application No. 17/150,300, filed on Jan. 15, 2021, granted, now 11,830,821.
Claims priority of provisional application 63/093,353, filed on Oct. 19, 2020.
Prior Publication US 2022/0384355 A1, Dec. 1, 2022
Int. Cl. H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01); H01L 25/10 (2006.01)
CPC H01L 23/5389 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 23/3128 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 25/0657 (2013.01); H01L 25/105 (2013.01); H01L 25/50 (2013.01); H01L 2221/68372 (2013.01); H01L 2224/214 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1058 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of manufacturing a semiconductor device, the method comprising:
adhering a semiconductor die to a first layer with an adhesive different from the first layer;
encapsulating the semiconductor die and through vias with an encapsulant;
removing the adhesive from the semiconductor die, wherein the removing the adhesive additionally forms recesses which expose at least a portion of a sidewall of the semiconductor die;
placing an interface material over the semiconductor die;
placing an underfill material around the interface material, wherein the underfill material fills the recess; and
placing a package in physical contact with the interface material.