US 12,131,982 B2
Electronic package structure with reduced vertical stress regions
Tae Kyung Hwang, Seoul (KR); Eun Sook Sohn, Seoul (KR); Won Joon Kang, Seoul (KR); and Gi Jeong Kim, Gyeonggi-do (KR)
Assigned to Amkor Technology Singapore Holding Pte. Ltd., Singapore (SG)
Filed by Amkor Technology Singapore Holding Pte. Ltd., Valley Point #12-03 (SG)
Filed on May 10, 2021, as Appl. No. 17/315,674.
Application 17/315,674 is a continuation of application No. 15/893,591, filed on Feb. 10, 2018, granted, now 11,011,455.
Application 15/893,591 is a continuation of application No. 14/984,554, filed on Dec. 30, 2015, granted, now 9,929,075, issued on Mar. 27, 2018.
Claims priority of application No. 10-2015-0029706 (KR), filed on Mar. 3, 2015.
Prior Publication US 2021/0265244 A1, Aug. 26, 2021
Int. Cl. H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01)
CPC H01L 23/49503 (2013.01) [H01L 23/3107 (2013.01); H01L 23/49541 (2013.01); H01L 23/49548 (2013.01); H01L 23/49861 (2013.01); H01L 23/49816 (2013.01); H01L 2224/16245 (2013.01); H01L 2924/181 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic package structure comprising:
a substrate comprising:
a lead frame comprising conductive members laterally spaced apart from each other, each conductive member having a conductive member top surface and an opposing conductive member bottom surface; and
a substrate encapsulant interposed between the conductive members, wherein the substrate encapsulant has a substrate top surface and an opposing substrate bottom surface;
an electronic device coupled to the conductive members with conductive bumps; and
a package body encapsulating the electronic device,
wherein:
the package body comprises a package body top surface and a package body bottom surface opposite to the package body top surface;
the package body bottom surface contacts the substrate top surface; and
the conductive members include a first conductive member comprising:
a first part exposed from the substrate bottom surface and defining a first connection point; and
a second part integral with the first part and laterally extending towards the electronic device and having a recessed bottom surface encapsulated by the substrate encapsulant, the second part defining a second connection point, wherein the first connection point is laterally separated from the second connection point, wherein the electronic device is attached to the second part at the second connection point with a first conductive bump, and wherein the electronic device overlaps the second connection point.