US 12,131,977 B2
Electronic systems with inverted circuit board with heat sink to chassis attachment
Barrett M. Faneuf, Beaverton, OR (US); Phil Geng, Washougal, WA (US); Kenan Arik, Hillsboro, OR (US); David Shia, Portland, OR (US); Casey Winkel, Hillsboro, OR (US); Sandeep Ahuja, Portland, OR (US); Eric D. McAfee, Portland, OR (US); Jeffory L Smalley, East Olympia, WA (US); Minh T. D. Le, North Plains, OR (US); Ralph V. Miele, Hillsboro, OR (US); Marc Milobinski, Scappoose, OR (US); Aaron P. Anderson, Beaverton, OR (US); Brendan T. Pavelek, Portland, OR (US); Carlos Alvizo Flores, Guadalajara (MX); and Fernando Gonzalez Lenero, Zapopan (MX)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Oct. 31, 2023, as Appl. No. 18/498,891.
Application 18/498,891 is a continuation of application No. 16/986,122, filed on Aug. 5, 2020, granted, now 11,842,943.
Claims priority of provisional application 62/883,532, filed on Aug. 6, 2019.
Prior Publication US 2024/0063082 A1, Feb. 22, 2024
Int. Cl. H01L 23/367 (2006.01); G11C 5/06 (2006.01); H05K 7/14 (2006.01); H05K 7/20 (2006.01)
CPC H01L 23/3677 (2013.01) [G11C 5/06 (2013.01); H05K 7/1422 (2013.01); H05K 7/20509 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a housing including a base and sidewalls, the housing to support a circuit board; and
a heat sink to be supported by the housing independent of the circuit board, the heat sink to be thermally coupled to a semiconductor package attached to the circuit board, the heat sink to be closer to the base of the housing than the circuit board is to be to the base of the housing.