US 12,131,971 B2
Semiconductor module
Shohei Maeda, Osaka (JP); and Yoichi Makimoto, Osaka (JP)
Assigned to SANSHA ELECTRIC MANUFACTURING CO., LTD., Osaka (JP)
Appl. No. 17/629,054
Filed by Sansha Electric Manufacturing Co., Ltd., Osaka (JP)
PCT Filed Dec. 24, 2019, PCT No. PCT/JP2019/050626
§ 371(c)(1), (2) Date Jan. 21, 2022,
PCT Pub. No. WO2021/019802, PCT Pub. Date Feb. 4, 2021.
Claims priority of application No. 2019-139877 (JP), filed on Jul. 30, 2019; and application No. 2019-145935 (JP), filed on Aug. 8, 2019.
Prior Publication US 2022/0278008 A1, Sep. 1, 2022
Int. Cl. H01L 23/31 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01); H02M 7/00 (2006.01)
CPC H01L 23/3107 (2013.01) [H01L 23/13 (2013.01); H01L 23/49838 (2013.01); H02M 7/003 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A semiconductor module comprising:
a case accommodating a semiconductor element inside and being entirely molded by a resin;
a first terminal surface provided on a top portion of the case;
a second terminal surface provided on the top portion of the case and being adjacent to the first terminal surface;
a first terminal placed on the first terminal surface and being a terminal to which a bus bar being a flat and elongated metal conductor is to be attached;
a second terminal placed on the second terminal surface; and
a rib provided between the first terminal and the second terminal, wherein the rib includes a protrusion protruding toward the bus bar.