US 12,131,958 B2
Sensor mounted wafer
Jeong Woon Bae, Suwon-si (KR); Ho Seung Jeon, Uijeongbu-si (KR); and Jung Sub Song, Ansan-si (KR)
Assigned to E-TRON CO., LTD., Seoul (KR)
Appl. No. 17/255,441
Filed by E-TRON CO., LTD., Seoul (KR)
PCT Filed Nov. 5, 2020, PCT No. PCT/KR2020/015383
§ 371(c)(1), (2) Date Dec. 23, 2020,
PCT Pub. No. WO2021/091249, PCT Pub. Date May 14, 2021.
Claims priority of application No. 10-2019-0140003 (KR), filed on Nov. 5, 2019.
Prior Publication US 2021/0375699 A1, Dec. 2, 2021
Int. Cl. H01L 21/66 (2006.01); H01J 37/32 (2006.01)
CPC H01L 22/12 (2013.01) [H01J 37/32935 (2013.01); H01L 22/14 (2013.01); H01L 22/34 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A sensor mounted wafer, comprising:
a lower case having a mounting groove formed on a surface of the lower case;
a circuit board on which, wherein an electronic component is mounted on the circuit board, and the circuit board is placed in the mounting groove;
an upper case having an insertion groove on a surface of the upper case, wherein the electronic component is inserted into the insertion groove, and the upper case is bonded together to the lower case; and
a metal layer placed on at least one surface of the lower case and the upper case, the metal layer comprises a first metal layer placed between the lower case and the circuit board and a second metal layer placed between the circuit board and the upper case, and the first metal layer and the second metal layer surround the electronic component,
wherein the circuit board comprises an antenna board and a plurality of sensor boards, wherein the antenna board has a concentric circle shape and the plurality of sensor boards extend from an outer circle of the antenna board to an outside and the plurality of sensor boards are arranged radially, and
wherein a charging antenna is provided in a coil shape on an inner circle of the antenna board, a communication antenna is provided in the coil shape on an outer circle of the antenna board, and a plurality of sensors are provided on the plurality of sensor boards.